Computer system with heat dissipation apparatus

ABSTRACT

A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

BACKGROUND

1. Technical Field

The present disclosure relates to computer systems, more particularly toa computer system with a heat dissipation apparatus.

2. Description of Related Art

Heat dissipation devices perform the critical function of removing heatfrom a computer system. For example, a plurality of fans may be providedto efficiently dissipate heat. Air is directed out of the computersystem by the fan, for dissipating heat generated in the computersystem. However, when the air flows in a disorderly manner in thecomputer system, the heat dissipation efficiency of the computer systemis decreased.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with referencesto the following drawings. The components in the drawings are notnecessarily drawn to scale, the emphasis instead being placed uponclearly illustrating the principles of the embodiments. Moreover, in thedrawings, like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 is an exploded, isometric view of a computer system in accordancewith an exemplary embodiment.

FIG. 2 is similar to FIG. 1, but viewed in another aspect.

FIG. 3 is an isometric view of an air duct of FIG. 1.

FIG. 4 is exploded, isometric view of FIG. 1 when the air duct assembledto a computer case.

FIG. 5 is similar to FIG. 4, but viewed in another aspect.

FIG. 6 is an assembled view of FIG. 1.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way oflimitation in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that referencesto “an” or “one” embodiment in this disclosure are not necessarily tothe same embodiment, and such references mean at least one.

Referring to FIG. 1, a computer system in accordance with an exemplaryembodiment includes a computer case 10, an air duct 20, and a cover 30attached to the computer case 10. In one exemplary embodiment, thecomputer system can be an all-in-one computer.

The computer base includes a display 11, a housing 12 connected to thedisplay 11, and a motherboard 13 mounted on the housing 12. The display11 is secured to a first side of the housing 12, and the motherboard 13is attached to a second side of the housing 12 that is opposite to thefirst side.

The housing 12 includes a bottom panel 121. The motherboard 13 includesvarious components. The components include a plurality of memory cards131 parallel to each other. A heat dissipation base 133 is mounted on acentral processing unit (not shown). A fin assembly 136 and a fan module137 corresponding to the fin assembly 136 are mounted in the middle ofthe housing 12. The fin assembly 136 includes a plurality of finsparallel to each other. A plurality of heat pipes 17 are connectedbetween the heat dissipation base 133 and the fin assembly 136. The fanmodule 137 defines an input vent 1371 and an output vent 1373. Theoutput vent 1373 corresponds to the fin assembly 136. The input vent1371 is substantially perpendicular to the output vent 1373. The inputvent 1371 is substantially parallel to the motherboard 13.

Referring to FIGS. 1 and 3, the air duct 20 includes a top plate 21 thatis substantially parallel to the motherboard 13, a first side plate 22extending from the top plate 21, a second side plate 23 extending fromthe top plate 21, and a third side plate 24 extending from the top plate21. The first side plate 22, the second side plate 23, and the thirdside plate 24 are substantially perpendicular to the top plate 21. Thefirst side plate 22 and the second side plate 23 are substantiallyparallel to each other. The third side plate 24 is substantiallyperpendicular to the first side plate 22. The top plate 21 issubstantially parallel to the memory card 131.

The top plate 21 defines a plurality of through holes 211 correspondingto the memory cards 131. The first side plate 22 defines a plurality offirst elongated airflow holes 221. The second side plate 23 defines aplurality of second elongated airflow holes 231. The second elongatedairflow holes 231 are adjacent to the third side plate 24. The air duct20 further includes a resisting plate 25 extending from the top plate21. The resisting plate 25 is used for resisting the cover 30 to keep adistance between the top plate 21 and the cover 30. The second sideplate 23 is substantially perpendicular to the memory card 131.

An input opening 31 is defined in the cover 30 corresponding to thefirst elongated airflow hole 221 of the first side plate 22. An outputopening 33 is defined in another side of the cover 30 corresponding tothe fin assembly 136.

Referring to FIGS. 1 to 6, in assembly, the air duct 20 is located overthe memory cards 131. At this time, the through holes 211 of the topplate 21 and the second elongated airflow holes 231 correspond to thememory cards 131. The cover 30 is mounted on the computer case 10. Thecover 30 resists the resisting plate 25 of the air duct 20. The inputopening 31 corresponds to the first elongated airflow holes 221 of thefirst side plate 22. The output opening 33 corresponds to the finassembly 136.

In use, air flows into the first input opening 31. Air flows into theair duct 20 to dissipate heat generated by the memory cards 131 via thethrough holes 211, the first elongated airflow holes 221 and the secondelongated airflow holes 231. At the same time, air flows to the heatdissipation base 133. Finally, air flows to the fin assembly 136 by thefan module 137 and flows out of the computer system via the outputopening 33.

It is to be understood, however, that even though numerouscharacteristics and advantages have been set forth in the foregoingdescription of embodiments, together with details of the structures andfunctions of the embodiments, the disclosure is illustrative only andchanges may be made in detail, especially in matters of shape, size, andarrangement of parts within the principles of the disclosure to the fullextent indicated by the broad general meaning of the terms in which theappended claims are expressed.

What is claimed is:
 1. A computer system comprising: a computer case,the computer case comprising a display, a housing connected to thedisplay, a motherboard located on the housing, and a fan module; themotherboard comprising a heat generating component; a cover, an inputopening and an output opening defined in the cover, the output openingcorresponding to the fan module; and an air duct, the air duct mountedover the heat generating component; the air duct comprising a top platesubstantially parallel to the motherboard and a first side plateextending from the top plate; the first side plate substantiallyperpendicular to the top plate; the first side plate defines a pluralityof first airflow holes that corresponding to the input opening; and thetop plate defining a plurality of through holes that corresponding tothe heat generating component.
 2. The computer system of claim 1,wherein the air duct further comprises a second side plate extendingfrom the top plate; the second side plate is substantially perpendicularto the top plate and substantially parallel to the first side plate; andthe second side plate defines a plurality of second airflow holes. 3.The computer system of claim 2, wherein the air duct further comprises athird side plate connected between the first side plate and the secondside plate, and the plurality of second airflow holes is located in thesecond side plate.
 4. The computer system of claim 3, wherein the thirdside plate is substantially perpendicular to the top plate.
 5. Thecomputer system of claim 1, wherein the air duct further comprises aresisting plate extending from the top plate, and the resisting plateabuts the cover to keep a distance between the cover and the top plate.6. The computer system of claim 1, wherein the heat generating componentis a memory card, the memory card is substantially parallel to themotherboard.
 7. The computer system of claim 1, further comprising a finassembly corresponding to the output opening, wherein the fan moduledefines an output vent corresponding to the fin assembly.
 8. Thecomputer system of claim 7, wherein the fan module defines an input ventsubstantially perpendicular to the output vent.
 9. The computer systemof claim 1, wherein the plurality of first airflow holes are elongatedholes.
 10. A computer system comprising: a computer case, the computercase comprising a display, a housing connected to the display, amotherboard located on the housing, a fan module, a heat dissipationbase configured to contact a first heat generating component, a finassembly, a heat pipe connected between the heat dissipation base andthe fin assembly; the motherboard comprising a second heat generatingcomponent; the fan module defining an input vent and an output vent; theoutput vent corresponding to the fin assembly; and the input ventsubstantially parallel to the motherboard; a cover, an input opening andan output opening defined in the cover, the output opening correspondingto the fin assembly; and an air duct, the air duct mounted over thesecond heat generating component and the heat dissipation base; the airduct comprising a top plate that is substantially parallel to themotherboard and a resisting plate extending from the top plate; theresisting plate abutting the cover to keep a distance between the coverand the top plate; and the top plate defining a plurality of throughholes corresponding to the second heat generating component.
 11. Thecomputer system of claim 10, wherein the air duct further comprises afirst side plate extending from the top plate; the first side plate issubstantially perpendicular to the top plate; and the first side platedefines a plurality of first airflow holes corresponding to the inputopening.
 12. The computer system of claim 11, wherein the air ductfurther comprises a second side plate extending from the top plate; thesecond side plate is substantially perpendicular to the top plate andsubstantially parallel to the first side plate; and the second sideplate defines a plurality of second airflow holes.
 13. The computersystem of claim 12, wherein the air duct further comprises a third sideplate connected between the first side plate and the second side plate,and the plurality of second airflow holes is located in the second sideplate.
 14. The computer system of claim 13, wherein the third side plateis substantially perpendicular to the top plate.
 15. The computer systemof claim 11, wherein the plurality of first airflow holes are elongatedholes.
 16. The computer system of claim 10, wherein the second heatgenerating component is a memory card, the memory card is substantiallyparallel to the motherboard.
 17. The computer system of claim 10,wherein the input vent is substantially perpendicular to the outputvent.